In this free webinar, Dow’s Fumi Nishida and Alejandro Boué explain how to protect and enhance the efficiency of electronic components using a new thermally conductive gap filler.

Key topics and takeaways:

• Gain insight into Dow’s new DOWSIL™ TC-5150 Thermally Conductive Gap Filler, a one-part, non-curable, and high-performance material
• Learn how to improve thermal conductivity in electronic components with a gap filler that can solve multiple design challenges
• Discover a solution that eliminates mixing and cure requirements for increased productivity and reduced energy consumption