Improving thermal conductivity in automotive and 5G ecosystem electronics

Connected VehiclesMaterials

Fumi Nishida, Senior TS&D Scientist, Dow

Alejandro Boué, Latin America Marketing Manager for Dow Mobility & Transportation and Consumer & Electronics, Dow | LinkedIn

In this free webinar, Dow’s Fumi Nishida and Alejandro Boué explain how to protect and enhance the efficiency of electronic components using a new thermally conductive gap filler.

Key topics and takeaways:

  • Gain insight into Dow’s new DOWSIL™ TC-5150 Thermally Conductive Gap Filler, a one-part, non-curable, and high-performance material
  • Learn how to improve thermal conductivity in electronic components with a gap filler that can solve multiple design challenges
  • Discover a solution that eliminates mixing and cure requirements for increased productivity and reduced energy consumption
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Dow

Dow is a global leader in material technologies and innovation, serving customers throughout the value chain.

Dow builds on 100+ years of transportation experience and expertise in application development to deliver innovative, cutting-edge solutions that keep the world moving. Dow MobilityScience™ materials add proven reliability and efficiency for sealing, protecting, adhering, cooling, and enhancing technologies across a wide range of segments.

Its MobilityScience™ team provides OEMs and Tiers with a seamless and collaborative global partner for materials innovation through access to world-class technical capabilities and a broad portfolio of materials science solutions for the industry.

Dow is committed to the future of mobility and is addressing the most pressing mobility challenges like de-carbonization and improving EV performance.

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Meet the experts

Fumi Nishida

Senior TS&D Scientist, Dow

Alejandro Boué

Latin America Marketing Manager for Dow Mobility & Transportation and Consumer & Electronics, Dow