Can’t attend live? Register anyway, and we’ll send you a link to the slides and a video of the webinar when it’s finished.

X-in-1 system integration (one box, one board, one chip) is rapidly shaping the future of vehicle electrification, with OEMs and Tier 1 suppliers driving strong adoption. Yet increased integration brings challenges, particularly in software isolation, functional safety, and scalability.

In this free, 60-minute webinar, Vincent Lagardelle will explore key market trends and show how NXP’s X-in-1 modular platform solution enables safer, faster, and scalable electric vehicle designs.

Key topics and takeaways:

• X-in-1 Integration: how consolidating ECU functions can reduce cost, weight, and complexity.
• S32 “One Chip” MCU: enabling hardware-enforced isolation and freedom from interference (FFI).
• FlexFoundation Suite: tools combining hardware, software orchestration, and GUI-based tools to simplify integration and safety.
• Scalable Modular Platform: flexibility to adapt designs across vehicle architectures and development needs.
• FuSa & Documentation Support: resources to streamline safety certification.