X-in-1 system integration (one box, one board, one chip) is rapidly shaping the future of vehicle electrification, with OEMs and Tier 1 suppliers driving strong adoption. Yet increased integration brings challenges, particularly in software isolation, functional safety, and scalability.

In this free webinar, Vincent Lagardelle explores key market trends and show how NXP’s X-in-1 modular platform solution enables safer, faster, and scalable electric vehicle designs.

Key topics and takeaways:

• X-in-1 Integration: how consolidating ECU functions can reduce cost, weight, and complexity.
• S32 “One Chip” MCU: enabling hardware-enforced isolation and freedom from interference (FFI).
• FlexFoundation Suite: tools combining hardware, software orchestration, and GUI-based tools to simplify integration and safety.
• Scalable Modular Platform: flexibility to adapt designs across vehicle architectures and development needs.
• FuSa & Documentation Support: resources to streamline safety certification.